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052026.10

Czochralski vs. VGF: Why Compound Semiconductors Favor Gradient Freeze Crystal Growth

In compound semiconductor crys…

052026.10

Metrology Becomes the Key to Yield: The Industry’s ‘Eyes’ Support Advanced-Process Ramp

Metrology and inspection equip…

042026.10

Advanced Processes Drive Cleanroom Upgrades as Class 10/100 Cleanrooms Become Fab Standard

Advanced processes and advance…

042026.10

VGF Crystal Growth Furnaces Become Mainstream as InP and GaAs Production Localizes

With demand for InP and GaAs s…

032026.10

UPW and Wet Electronic Chemicals: The ‘Water Infrastructure’ Behind Wafer Cleaning

Ultra-pure water and wet elect…

032026.10

Hebei Positions for Third-Generation Semiconductors as Handan Builds Materials Cluster

Hebei is accelerating its thir…

032026.10

Nexchip Phase IV and Hua Hong Wuxi Phase III Kick Off One After Another as China’s 300mm Fabs Keep Expanding

Following earlier 300mm lines,…

022026.10

Advanced Packaging Reshapes Wet Cleaning: New Requirements for TSV, HBM and Hybrid Bonding

Advanced packaging including T…

022026.10

Chiplet and Heterogeneous Integration Heat Up as China’s Advanced Packaging Lines Top 20 Billion RMB

Chiplet and heterogeneous inte…

022026.10

SEMICON China 2026 Opens in Shanghai with 1,500 Exhibitors Charting a New Global Market

SEMICON China 2026 opened in S…

012026.10

The Post-CMP Cleaning Battle: Nanoparticle Removal and Spin-Rinse-Dryer Drying as Yield Defenders

Post-CMP cleaning is the last …

012026.10

Domestic 12-Inch Silicon Wafer Capacity Ramps Up to Support Chinese Fab Expansion

Chinese 12-inch wafer makers r…