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012026.10

National IC Industry Fund Phase III Registered at RMB 344 Billion, Targeting Equipment and Materials

China’s National Integrated Ci…

302026.09

8-Inch GaN-on-Silicon Production Speeds Up as Power Devices Target AI Data Center Power

Driven by AI data center power…

302026.09

Core Components of Cleaning Equipment Go Domestic: Valves, Pumps, MFCs and Temperature Controllers

The performance of wafer clean…

292026.09

Domestic Single-Wafer Cleaning Accelerates as ACM Research Reaches About 8% Global Share

ACM Research has lifted its gl…

292026.09

Third-Generation Semiconductor Expansion Reshapes Supply as 8-Inch SiC Substrates Enter Mass Delivery

Chinese SiC substrate makers a…

282026.09

Global Wafer Cleaning Equipment Market Set for ~$6.9 Billion in 2026 as the Single-Wafer Shift Reshapes a Three-Way Race

The global wafer cleaning equi…

282026.09

AI Demand Ignites an HBM Capacity Build-Out as the Big Three Memory Makers Race to Add Capacity

Exploding demand for AI comput…

272026.09

Wafer Particle and Defect Inspection Heats Up as Optical and E-Beam Routes Support Yield

Wafer particle and defect insp…

272026.09

TSMC’s 2-Nanometer Process Enters Mass Production, Accelerating Global Wafer Expansion

TSMC has moved its 2-nanometer…

262026.09

Lithography Localization Steady as 28nm Immersion DUV Enters Batch Delivery

Chinese 28nm immersion DUV lit…